Zinc Sulfide Sputtering Target Bonded to Copper Backplane

       Zinc Sulfide Sputtering Target FeaturesChemical Composition: zinc sulfideAvailable Purity: 3N5Production Technology: Powder MetallurgyShapes: planar targetsAvailable size: round target, diameter ≤ 14", rectangle target, according to your requirementIndium bonding is recommended f

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Zinc Sulfide Sputtering Target Features

Chemical Composition: zinc sulfide

Available Purity: 3N5

Production Technology: Powder Metallurgy

Shapes: planar targets

Available size: round target, diameter ≤ 14", rectangle target, according to your requirement

Indium bonding is recommended for this materials

Advantages: uniform color, smooth surface, no cracks, no chipping, no foreign inclusions and contaminants.

Company Profile:

Since 2014

Specializing in high purity sputtering targets.

Leader manufacturer of sputtering materials in China.

Qualified the world certificates such as ISO9001:2008 and SGS.

Comprehensive in R&D, manufacturing, and sales on thin film materials.

Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.

Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded  
OUR PRODUCTS     

*Metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.

*Alloy Target : NiFe, NiCr, NiV, CuNi,TiAl, CoCr, CoFe, WTi, CoTaZr,CuInGa, ZnSn, CuZn, etc

*Ceramic Target : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2, MoS2,Ga2O3,HfO2,etc

*Evaporation Materials : Crucible, Pellets,Granules,Pieces,etc

*Backing Plate: Cu, Mo, SS,etc

*Bonding Service: Indium, Elastomer

                  

Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded


 OUR ADVANTAGE

1,Many years manufacturing & exporting experience.

2 Strict & complete QC systerm

3,Perfect after sale systerm
Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
 PRODUCTION PROCESS

Vacuum electron beam furnace, vacuum induction melting furnace, forging machine, rolling mill, oil press,

vacuum annealing furnace, numerical control lathe, numerical control milling machine, machining center, 

grinding machine, wire cutting, numerical control water cutting, XRF, icp-oes, metallographic detector, etc

Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded

PACKING & DELIVERY
 
Packaging Detail:

Inside: drying agent and vacuum sealed to prevent oxidization
Outside: wooden case to avoid damage during transportation


 

Delivery Detail:

Within 3-15 working days .
DHL, FedEx, UPS door to door service, 5-7 days from China to your country.

 

OUR CERTIFICATE

Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded

Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
 

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