Copper plate bonded copper sulfide ceramic target

       Cu2S Sputtering Target FeaturesChemical Composition: copper sulfideAvailable Purity: 3N5Production Technology: Powder MetallurgyShapes: planar targetsAvailable size: round target, diameter ≤ 14", rectangle target, according to your requirementIndium bonding is recommended for thi

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Cu2S Sputtering Target Features

Chemical Composition: copper sulfide

Available Purity: 3N5

Production Technology: Powder Metallurgy

Shapes: planar targets

Available size: round target, diameter ≤ 14", rectangle target, according to your requirement

Indium bonding is recommended for this materials

Advantages: uniform color, smooth surface, no cracks, no chipping, no foreign inclusions and contaminants.

Company Profile:

Since 2014

Specializing in high purity sputtering targets.

Leader manufacturer of sputtering materials in China.

Qualified the world certificates such as ISO9001:2008 and SGS.

Comprehensive in R&D, manufacturing, and sales on thin film materials.

Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.

Copper Sulfide Ceramic Target with Copper Plate Bonding  
OUR PRODUCTS     

*Metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.

*Alloy Target : NiFe, NiCr, NiV, CuNi,TiAl, CoCr, CoFe, WTi, CoTaZr,CuInGa, ZnSn, CuZn, etc

*Ceramic Target : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2, MoS2,Ga2O3,HfO2,etc

*Evaporation Materials : Crucible, Pellets,Granules,Pieces,etc

*Backing Plate: Cu, Mo, SS,etc

*Bonding Service: Indium, Elastomer
          Copper Sulfide Ceramic Target with Copper Plate Bonding

 OUR ADVANTAGE

1,Many years manufacturing & exporting experience.

2 Strict & complete QC systerm

3,Perfect after sale systerm
Copper Sulfide Ceramic Target with Copper Plate Bonding
 PRODUCTION PROCESS

Vacuum electron beam furnace, vacuum induction melting furnace, forging machine, rolling mill, oil press,

vacuum annealing furnace, numerical control lathe, numerical control milling machine, machining center, 

grinding machine, wire cutting, numerical control water cutting, XRF, icp-oes, metallographic detector, etc

Copper Sulfide Ceramic Target with Copper Plate Bonding

PACKING & DELIVERY
 
Packaging Detail:

Inside: drying agent and vacuum sealed to prevent oxidization
Outside: wooden case to avoid damage during transportation


 

Delivery Detail:

Within 3-15 working days .
DHL, FedEx, UPS door to door service, 5-7 days from China to your country.

 

OUR CERTIFICATE

Copper Sulfide Ceramic Target with Copper Plate Bonding


OUR FEEDBACK

Copper Sulfide Ceramic Target with Copper Plate Bonding


 

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